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| G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Features : Description : GLT625608 is a 262,144-bit static random access Available in 70/100ns(MAX.) Automatic power-down when chip disabled memory organized as 32,768 words by 8 bits and operates from a single 5 volt supply. Inputs and Low power consumption: GLT625608 -467.5mW(Max.) Operating -500W(Max.)Standby TTL compatible interface levels Single 5V power supply Fully static operation Three state outputs 256K bit EPROM pin compatible Data Retention as low as 2V Industrial Grade (-40C~85C) available. three-state outputs are TTL compatible and allow for direct interfacing with system I/O bus. The GLT625608 is available in a standard 330 mil SOP packages. Other packages will also available upon request. Pin Configurations: GLT625608 Function Block Diagram : G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -1- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Pin Descriptions: Name A0 - A14 WE OE CE Function Address Inputs Write Enable Output Enable Chip Enable Data Input/Output Power Supply (+5V) Ground I/O0-I/O7 Vcc GND Truth Table: Mode Not Selected ( Power down ) Output Disabled Read Write WE X H H L CE H L L L OE X H L X I/O Operation High Z High Z High Z DOUT DIN Supply Current ISB,ISB1 ISB,ISB1 ICC ICC ICC NOTE: X : H or L Absolute Maximum Ratings: Ambient Temperature Under Bias...................................-10C to +80C Storage Temperature(plastic)....-55C to +125C Voltage Relative to GND.............-0.5V to + 7.0V Data Output Current..................................50mA Power Dissipation......................................1.0W 1.Stresses greater than those listed under ABSOLUTE MAXIMUM RATING may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Operation Range : RANGE Commercial Industrial AMBIENT TEMPERATURE 0C to + 70C -40C to 85C Vcc 5V 10% 5V 10% Capaccitance(1)(TA=25C,F=1.0MHZ) SYMBOL CIN CDQ PARAMETER Input Capacitance Input/Output capacitance CONDIT IONS VIN=0V VI/O=0 MAX. 6 8 UNIT pF pF 1.This parameter is guaranteed and tested. G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -2- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) DC Characteristics Sym. Parameter VIL VIH ILI ILO VOL VOH ICC Test Conditions Min. Typ(1) -0.3 2.2 -5 -5 2.4 - Max. +0.8 VCC+0.3 5 5 0.4 100 20 Unit V V A A V V mA mA Guaranteed Input Low Voltage (2)(3) Guaranteed Input High Voltage (2) Input Leakage Current VCC=Max., VIN=0V to VCC Output Leakage Current V =Max., CE V CC IH Output Low Voltage VCC=Min.,IOL =8mA Output High Voltage VCC=Min., IOH =-4mA Operating Power Supply V =Max., CE V , CC IL Current I =0mA., F=F (3) I/O max ICCSB Standby Power Supply Current ICCSB1 Power Down Power Supply Current VCC=Max., CE VIH, II/O=0mA., F=Fmax(3) 10 10 mA VCC=Max., CE VCC.-0.2V, VINVCC. -0.2V or 1. Typical characteristics are at VCC=5V, TA=25C. 2. These are absolute values with repeat to device ground and all overshoots due to system or tester noise are included. 3. FMAX=1/tRC. Data Retention Sym. VDR ICCDR tCDR tR Parameter Test Conditions Min. Typ Max. Unit 2.0 0 tRC(2) 2 50 V A(1) ) VCC for Data retention CE V -0.2V CC VIN VCC -0.2V or VIN 0.2V Data Retention CE V - 0.2V DR Current VIN VDR - 0.2V or VIN 0.2V Chip Deselect to Data Retention Time See Retention Waveform Operating Recovery Time ns ns 1. VDR = 3V, TA = Specified 2. tRC = Read Cycle Time G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -3- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Low VCC Data Retention Waveform ( CE Controlled ) AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level 0V to 3.0V 3ns 1.5V AC Test Loads and Waveforms G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -4- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) AC Electrical Characteristics Read Cycle JEDEC Parameter Name 625608-70 Parameter Name Parameter Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Deselect to Output in Low Z Output Enable to Output in Low Z Chip Deselect to Output in High Z Output Disable to Output in High Z Output Hold from Address Change Min. Max. 625608-10 Min. Max. Unit tAVAX tAVQV tELQV tGLQV tELQZ tGLQX tEHQZ tGHQZ tAXQX tRC tAA tACS tOE tCLZ tOLZ tCHZ tOHZ tOH 70 5 5 0 0 5 70 70 40 30 30 - 100 10 5 0 0 10 100 100 50 35 35 - ns ns ns ns ns ns ns ns ns G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -5- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Switching Waveforms (Read Cycle) READ CYCLE 1(1,2,4) READ CYCLE 2(1,3,4) READ CYCLE 3(1) Notes: 1. WE is High for READ Cycle. 2. Device is continuously selected OE = VIL. 3. Address valid prior to or coincident with CE transition low. 4. CE = VIL. 5. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1b. This parameter is guaranteed but not 100% tested. G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -6- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) AC Electrical Characteristics Write Cycle JEDEC Parameter Name 625608-70 Parameter Name Parameter Write Cycle Time Chip Enable to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width Write Recovery Time Data to Write Time Overlap Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active Min. Max. 625608-10 Min. Max. Unit tAVAX tELWH tAVWL tAVWH tWLWH tWHAX tWLQZ tDVWH tWHDX tGHQZ tWHQX tWC tCW tAS tAW tWP tWR1 tWHZ tDW tDH tOHZ tOW 70 65 0 65 55 5 0 35 0 0 5 30 30 - 100 90 0 90 75 5 0 40 0 0 5 35 40 - ns ns ns ns ns ns ns ns ns ns ns Switching Waveforms (Write Cycle) WRITE CYCLE 1(1) G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -7- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) WRITE CYCLE 2(1,6) Note: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE or WE going high at the end of write cycle. 4. During this period, I/O pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE transition, outputs remain in a high impedance state. 6. OE is continuously low ( OE =VIL). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE is low is high during this period, I/O pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 200mV from steady state with CL=5pF. 11. tCW is measured from CE going low to the end of write. G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -8- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Ordering Information Part Number GLT625608-10J3 GLT625608-70J3 GLT625608-10TS GLT625608-70TS GLT625608-10TC GLT625608-70TC GLT625608-10FB GLT625608-70FB SPEED 10ns 70ns 10ns 70ns 10ns 70ns 10ns 70ns POWER Normal Normal Normal Normal Normal Normal Normal Normal PACKAGE SOJ 300mil 28L SOJ 300mil 28L TSOPI 28L TSOPI 28L TSOPII 28L TSOPII 28L SOP 330mil 28L SOP 330mil 28L Parts Numbers (Top Mark) Definition : GLT 6 256 4 : DRAM 6 : Standard SRAM 7 : Cache SRAM 8 : Synchronous Burst SRAM -SRAM 064 : 8K 256 : 256K 512 : 512K 100 : 1M -DRAM 10 : 1M(C/EDO)* 11 : 1M(C/FPM)* 12 : 1M(H/EDO)* 13 : 1M(H/FPM)* 20 : 2M(EDO) 21 : 2M(FPM) 40 : 4M(EDO) 41 : 4M(FPM) 80 : 8M(EDO) 81 : 8M(FPM) 160 : 16M(EDO) 161 : 16M(FPM) 08 CONFIG. 04 : x04 08 : x08 16 : x16 32 : x32 I - 10 TC SPEED -SRAM 12 : 12ns 15 : 15ns 20 : 20ns 70 : 70ns -DRAM 35 : 35ns 40 : 40ns 45 : 45ns 50 : 50ns 60 : 60ns PACKAGE T : PDIP(300mil) TS : TSOP(Type I) TC : TSOP(Type ll) PL : PLCC FA : 300mil SOP FB : 330mil SOP FC : 445mil SOP J3 : 300mil SOJ J4 : 400mil SOJ P : PDIP(600mil) Q : PQFP TQ : TQFP VOLTAGE Blank : 5V L : 3.3V M : 2.5V N : 2.1V Temperature Range E : Extended Temperature I : Industrial Temperature Blank : Commercial Temperature G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. -9- G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) Package Information 300mil 28 Lead Small Outline J-form Package (SOJ) G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. - 10 - G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) 28 L (8 x 13.4 mm ) Thin Small Outline Package (TSOP) Type I G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. - 11 - G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) 28 L (8 x 20 mm ) Thin Small Outline Package (TSOP) Type I G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. - 12 - G -LINK GLT625608 32K x 8 SLOW SPEED CMOS STATIC RAM Feb, 2001(Rev. 1.1) 330mil 28 Lead Thin Small Outline(Gull-Wing) Package (SOP) G-Link Technology Corporation 2701 Northwestern Parkway Santa Clara, CA 95051, U.S.A. G-Link Technology Corporation,Taiwan 6F,No. 24-2, Industry E. RD. IV, Science Based Industrial Park, Hsin Chu, Tawian. - 13 - |
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